In the PCBA circuit board production process, you need to rely on a lot of machinery and equipment in order to assemble a board to complete, often the quality level of a factory's machinery and equipment directly determine the ability of this manufacturing.

　　The basic equipment required for PCBA production are solder paste printing machine, placement machine, reflow soldering, AOI detector, component shearing machine, wave soldering, tin furnace, board washing machine, ICT test fixture, FCT test fixture, aging test rack, etc. Different sizes of PCBA circuit board processing factory, the equipment equipped with all the different.

　　Electronics factory PCBA production equipment

　　1. Solder paste printing machine

　　Modern solder paste printing machine is generally composed of loading plate, adding solder paste, embossing, losing circuit board and other institutions. Its working principle is: first to be printed circuit board fixed in the printing positioning table, and then by the printer's left and right scraper to the solder paste or red glue through the stencil leakage printed on the corresponding pads, the leakage of uniform PCB, through the transfer table input to the placement machine for automatic placement.

　　Solder paste printing machine contains cleaning processes: solder paste printing machine bottom wipe (water-based cleaning agent W2000), solder paste stencil off-line cleaning (W1000/EC-200).

What electronic auxiliary materials are needed in the production process of PCBA circuit boards?

　　2. Laminating machine

　　SMD machine: also known as "mount machine", "surface mount system" (Surface Mount System), in the production line, it is configured after the solder paste printing machine, is through the mobile mount head to accurately place the surface mount components PCB pad on a kind of equipment. It is divided into manual and fully automatic two kinds.

　　3. Reflow soldering

　　Reflow soldering has a heating circuit inside, which heats the air or nitrogen to a high enough temperature and then blows it to the circuit board where the components have been pasted, so that the solder on both sides of the components will melt and bond with the main board. The advantage of this process is that the temperature is easy to control, the soldering process also avoids oxidation, and manufacturing costs are easier to control.

　　Solderback oven workshop scene of SMT production line

　　4. AOI (Automatic Optical Inspection)

　　AOI (Automatic Optic Inspection), whose full name is Automatic Optical Inspection, is a device based on optical principles to detect common defects encountered in soldering production.AOI is a newly emerging new testing technology, but is developing rapidly, and many manufacturers have introduced AOI automatic optical inspection equipment.

　　When automatic detection, the machine automatically scans the PCB through the camera, collects images, the tested solder joints are compared with the qualified parameters in the database, and after image processing, the defects on the PCB are checked and the defects are displayed/marked out through the monitor or automatic signs for maintenance personnel to fix.

　　5. Component foot cutter

　　6. wave soldering

　　7. Solder Furnace

　　In general, the tin furnace refers to a soldering tool used in electronic joint soldering. For discrete components circuit board welding consistency is good, easy to operate, fast, high efficiency, is your production and processing of good helper.

　　8. board washing machine (ultrasonic or through the spray cleaning machine)

　　Used for cleaning PCBA circuit board, can remove the pollutants and residues of the board after soldering. Improve and guarantee the reliability of PCBA circuit board.

　　W3000 is a new environmentally friendly water-based product developed using Shenzhen Heming Technology Co., Ltd.'s independent research and development patent technology, breaking the conventional PCBA water-based cleaning agent needs to be heated cleaning method, at room temperature (25 ~ 40 ℃) can achieve the ideal cleaning effect, and short cleaning time, high efficiency.

　　For various types of no-clean solder paste residue, flux residue, oil, handprints, metal oxide layer, and electrostatic particles and dust Particle have very good removal ability. With the ultrasonic cleaning process, can be used for camera modules with high precision, high density, assembled with microBGAs, Flip-Chips and other high-tech components of high clean cleaning

　　9. ICT Test Fixture

　　ICT Test is mainly * test probe contact PCB layout out of the test point to detect the PCBA line open, short circuit, all parts of the welding situation.

　　10.FCT Test Fixture

　　FCT (Functional Test) It refers to the test target board (UUT: Unit Under Test) to provide a simulated operating environment (excitation and load), so that it works in various design states, so as to obtain the parameters of each state to verify the functionality of the UUT test method. Simply put, it is to load the UUT with suitable excitation and measure whether the output response meets the requirements.

　　11. Aging Test Rack

　　Aging test rack can be batch testing of PCBA board, through a long time and other simulated user operation, test out the problem PCBA board.

　　12. Cleaning process links include

　　Solder paste printing machine bottom wipe, solder paste stencil cleaning, red glue stencil cleaning, clip jig carrier cleaning, PCB circuit board cleaning, etc.