Circuit board production is a complex process, as the motherboard of the product, always bears more or less risk and responsibility. Especially the circuit board in the welding process, is a test of the motherboard and the components intact contact process, if not pay attention to, will lead to the whole product work poorly or even can not work.

      Circuit boards should be dust-free throughout the production process, especially in the exposure, etching, subsequent spraying, gold sinking, testing, packaging process, must be dust-free, so as to avoid debris on the solder paste or pads, affecting the soldering. These processes will be especially strengthened by our company to ensure zero complaints and feedback as the ultimate goal. Manual labor in the detection process should pay attention to ensure that no sweat stains on the hands, as far as possible with gloves to operate, which includes SMD assembly personnel in the assembly of juggling solder paste before also pay attention to, as far as possible before welding cleaning pads, if the pads are very precise, the requirements are particularly strict. As for the sink gold circuit board to pay special attention to the outside air oxidation and sweat oxidation, sink gold circuit boards are more prone to oxidation, welding manufacturers and customers in not ready to patch before try to ensure that the circuit board manufacturers factory packaging integrity, do not easily go to remove the vacuum packaging, otherwise oxidation will cause difficulties after patching.

      Spray tin circuit board should pay attention to ensure that the tin surface clean and neat, pay special attention to ensure that the tin surface flat, spray tin will have water stains, is not clean tin surface cleaning caused by, should be reworked to deal with. The tin surface should not be flat in the spray tin process improperly caused, should be adjusted in a timely manner. SMT SMD manufacturers should pay attention to cleaning the tin surface as much as possible before welding, precision pads should ensure that when soldering tin full, conditions should add flux soldering. General now requires environmentally friendly products, so the factory is lead-free tin, lead-free circuit board will cause welding difficulties, welding can add the appropriate flux to help the circuit board pads eat tin saturation.

      Immersion gold circuit board in the welding before if found welding a slight oxidation, you should first wipe with alcohol, and then add flux soldering. Generally do not produce too big a problem.